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LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only
TAPE AND BOX TYPE LED LAMPS
LDBK2640/TBS-X
DATA SHEET
DOC. NO : REV. DATE : :
QW0905- LDBK2640/TBS-X A 07 - Dec.- 2005
LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only
PART NO. LDBK2640/TBS-X Page 1/5
Package Dimensions
H
P2
H2 H1 L W0
W2
W1 W3
D
P1
F P
-+
T
LDBK2640
2.9
3.1
3.3 1.5 MAX
4.3
25.0MIN
0.5 TYP
1.0MIN 2.54TYP Note : 1.All dimension are in millimeter tolerance is 0.25mm unless otherwise noted. 2.Specifications are subject to change without notice.
+
-
LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only
PART NO. LDBK2640/TBS-X Page 2/5
Absolute Maximum Ratings at Ta=25
Ratings Parameter Symbol DBK Forward Current Peak Forward Current Duty 1/10@10KHz Power Dissipation Reverse Current @5V Electrostatic Discharge( * ) Operating Temperature Storage Temperature Soldering Temperature IF IFP PD Ir ESD Topr Tstg Tsol 30 100 120 50 150 -20 ~ +80 -30 ~ +100 Max 260 for 5 sec Max (2mm from body) mA mA mW UNIT
A V
Static Electricity or power surge will the Use of anti-electrosatic * glove is recommended when handingdamageLED.LED.devices, a conductive wrist band or must be properly these All equipment and machinery grounded.
Typical Electrical & Optical Characteristics (Ta=25 )
PART NO
MATERIAL Emitted
COLOR Lens Blue Diffused
Forward Luminous Dominant Spectral Viewing voltage intensity wave angle halfwidth @20mA(V) @20mA(mcd) 2 1/2 length nm D nm (deg)
Typ. Max. Min. Typ. 470 30 3.5 4.0 220 450 38
LDBK2640/TBS-X InGaN/GaN Blue
Note : 1.The forward voltage data did not including 0.1V testing tolerance. 2. The luminous intensity data did not including 15% testing tolerance.
LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only
PART NO.LDBK2640/TBS-X *Dimensions Symbol Information SPECIFICATIONS SYMBOL ITEMS OPTION SYMBOL CODE
-------------------
Page 3/5
Minimum mm inch
0.15 0.09
-------
Maximum mm
4.2 3.0 2.0 18.5 22.5 26.5 28.5 23.5 20.9 25.0 25.5 20.0 19.4 36 11.0
inch
0.17 0.12 0.08 0.73 0.89 1.04 1.12 0.93 0.82 0.98 1.0 0.79 0.76 1.42 0.43 0.51 0.23 0.3 0.06 0.38 0.61 0.16 0.75
Tape Feed Hole Diameter Component Lead Pitch Front-To-Rear Deflection
D F
H
3.8 2.3
-------
Feed Hole To Bottom Of Component
TBS-1 TBS-2 TBS-3 TBS-4 TBS-5 TBS-6 TBS-7 TBS-8 TBS-9 TBS-10
-------------------------------------------------------------
H1
17.5 21.5 25.5 27.5 22.5 19.9 24.0 24.5 19.0 18.4
-------
0.69 0.85 1.0 1.08 0.89 0.78 0.94 0.96 0.75 0.72
-------
Feed Hole To Overall Component Height Lead Length After Component Height Feed Hole Pitch Lead Location Center Of Component Location Overall Taped Package Thickness Feed Hole Location Adhesive Tape Width Adhesive Tape Position Tape Width
H2 L P P1 P2 T W0 W1 W2 W3
W0 12.4 4.4 5.1
-------
0.49 0.17 0.2
-------
13.0 5.8 7.7 1.42 9.75 15.5 4.0 19.0
8.5 14.5 0 17.5
0.33 0.57 0 0.69
REMARK:TBS=Tape And Box Straight Leads
* Dimensions Symbol Information
Specification Description Symbol minimum mm
Overall Length Overall Width Overall Thickness
* Package Dimensions
maxmum W mm 340 275 60 inch 13.4 10.8 2.4 H L
inch 13.0 10.4 1.97 2500PCS
L W H
330 265 50
Quantity/Box
LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only
PART NO.LDBK2640/TBS-X Page 4/5
Typical Electro-Optical Characteristics Curve
DBK CHIP
Fig.1 Forward current vs. Forward Voltage Fig.2 Relative Intensity vs. Forward Current
3.0
1000
Forward Current(mA)
100 10 1 01 1.0 2.0 3.0 4.0 5.0
Relative Intensity Normalize @20mA
2.5 2.0 1.5 1.0 0.5 0.0 1 10 100 1000
Forward Voltage(V) Fig.3 Forward Voltage vs. Temperature
Forward Current(mA) Fig.4 Relative Intensity vs. Temperature
Forward Voltage@20mA Normalize @25
Relative Intensity@20mA Normalize @25
-40 -20 0 20 40 60 80 100
1.2
3.0 2.5 2.0 1.5 1.0 0.5 0.0 -40 -20 0 20 40 60 80 100
1.1 1.0
0.9
0.8
Ambient Temperature()
Ambient Temperature()
Fig.5 Relative Intensity vs. Wavelength
Fig.6 Directivity Radiation
Relative Intensity@20mA
1.0
0.5
0.0 400 450 500 550
Wavelength (nm)
LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only
PART NO.LDBK2640/TBS-X Page 5/5
Reliability Test:
Test Item
Test Condition
1.Under Room Temperature 2.If=20mA 3.t=1000 hrs (-24hrs, +72hrs)
Description
This test is conducted for the purpose of detemining the resisance of a part in electrical and themal stressed.
Reference Standard
MIL-STD-750: 1026 MIL-STD-883: 1005 JIS C 7021: B-1
Operating Life Test
High Temperature Storage Test
1.Ta=105 5 2.t=1000 hrs (-24hrs, +72hrs)
The purpose of this is the resistance of the device which is laid under ondition of high temperature for hours.
MIL-STD-883:1008 JIS C 7021: B-10
Low Temperature Storage Test
1.Ta=-40 5 2.t=1000 hrs (-24hrs, +72hrs)
The purpose of this is the resistance of the device which is laid under condition of low temperature for hours.
JIS C 7021: B-12
High Temperature High Humidity Test
1.Ta=65 5 2.RH=90 %~95 % 3.t=240hrs 2hrs
The purpose of this test is the resistance of the device under tropical for hous.
MIL-STD-202:103B JIS C 7021: B-11
Thermal Shock Test
1.Ta=105 5&-405 (10min) (10min) 2.total 10 cycles
The purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. This test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire.
MIL-STD-202: 107D MIL-STD-750: 1051 MIL-STD-883: 1011
Solder Resistance Test
1.T.Sol=260 5 2.Dwell time= 10 1sec.
MIL-STD-202: 210A MIL-STD-750: 2031 JIS C 7021: A-1
Solderability Test
1.T.Sol=230 5 2.Dwell time=5 1sec
This test intended to see soldering well performed or not.
MIL-STD-202: 208D MIL-STD-750: 2026 MIL-STD-883: 2003 JIS C 7021: A-2

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